Plastic pin grid arrays (PPGAs) are a type of integrated circuit (IC) package. They are similar to pin grid arrays (PGAs), but have their pins molded from plastic instead of metal. This makes PPGAs less expensive to manufacture than PGAs, but also less durable.
PPGAs are used in a variety of electronic devices, including computers, cell phones, and digital cameras. They are often used in applications where cost is a major consideration, such as in consumer electronics. What is a pin grid array used for? A pin grid array (PGA) is a type of integrated circuit packaging where the pins are arranged in a regular grid on the underside of the package. They are used to connect the IC to a printed circuit board (PCB) via a socket. PGA packages are usually square or rectangular, and have a large number of pins (typically 100 or more).
What is PGA in computing?
PGA is short for Pin Grid Array, and refers to the physical arrangement of the pins on a computer chip. PGA chips have two rows of pins, which are used to connect the chip to the motherboard. The pins on a PGA chip are arranged in a grid, which allows for more pins to be added to the chip than would be possible with a traditional square or rectangular pin arrangement.
What is the difference between BGA and LGA?
BGA and LGA are two types of integrated circuit packaging. BGA stands for ball grid array and LGA stands for land grid array.
The main difference between BGA and LGA is that BGA has the I/O pins (input/output pins) on the bottom of the package and LGA has the I/O pins on the sides of the package.
BGA is also generally smaller than LGA.
LGA is better for high pin count devices because it is easier to route the traces on the PCB (printed circuit board). BGA is better for devices with a small number of pins because it is easier to solder.
Both BGA and LGA have their pros and cons, and the decision of which to use depends on the specific application. What is the newest LGA? The newest LGA is the LGA 1151. It was released in 2015 and is used for Intel's 6th, 7th, and 8th generation processors.
What is the difference between pin grid array and land grid array?
There are two main types of grid arrays used in electronic components: pin grid arrays (PGAs) and land grid arrays (LGAs). Both types have an array of metal pins or lands on the bottom of the component that make contact with corresponding pads on a PCB. The major difference between PGAs and LGAs is in the way that the pins or lands are arranged.
In a PGA, the pins or lands are arranged in a rectangular grid. This makes it easy to connect the component to a PCB using through-hole technology. However, it can be difficult to connect the component to a PCB using surface-mount technology (SMT) because the solder joints between the pins and the PCB are very close together.
In an LGA, the pins or lands are arranged in a concentric circle around the center of the component. This makes it easy to connect the component to a PCB using SMT. However, it can be difficult to connect the component to a PCB using through-hole technology because the pins or lands are very close together.